ASMPT SEMI Unveils the Innovative MEGA Multi-Chip Bonding Platform
ASMPT SEMI, a leading innovator in packaging and semiconductor assembly technologies, has unveiled its latest MEGA multi-chip bonding platform, setting new benchmarks in precision and efficiency. This versatile device family features a modular design, compact footprint, and adaptability to various manufacturing needs.
Features of the MEGA Platform
The MEGA-G model excels in high-speed production, achieving up to 12,000 units per hour, while the MEGA-P offers exceptional placement accuracy of ±2 micrometers, making it ideal for photonics applications. The platform supports multiple bonding and dispensing methods, including epoxy stamping and side-by-side adhesive application, monitored by integrated 3D inspection systems. Immediate fixation options via UV curing further enhance process efficiency.
Design and Flexibility
Equipped with independent pick-and-bond arms, a flip-pick mechanism, and a precision rotation unit, the system ensures accurate chip alignment. Its flexible feeding options accommodate wafer sizes up to 12 inches and die dimensions from 0.15 × 0.15 mm to 10 × 10 ...