KOKI Solder America will host a technical webinar, “Printing for UHDI: Selecting the Right Solder Powder Size for Ultra-Fine Feature Assemblies,” on Thursday, November 19, 2026, at 1:00 PM ET. Presented in collaboration with SHEA Engineering Services and PARMI USA, the webinar will examine the challenges of solder paste printing for Ultra High Density Interconnect (UHDI) assemblies and share findings from a comparative study of Type 4, Type 5 and Type 6 solder pastes.
As electronics manufacturers move toward smaller components, finer pitches and increased circuit density, maintaining consistent solder paste deposition becomes increasingly difficult. Reduced stencil aperture dimensions can introduce challenges with aperture filling, paste release, transfer efficiency and print repeatability. These issues can contribute to insufficient solder deposits, inconsistent print volumes and downstream assembly defects.
While finer solder powder types are often considered for ultra-small apertures, selecting the appropriate powder size requires more than evaluating particle dimensions alone. Stencil area ratio, aperture geometry, component orientation and board design characteristics can all ...