Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that electronics manufacturers, process engineers and stencil suppliers can now schedule live demonstrations of the Sawa T100 Automatic Stencil Inspection System at Rochester Institute of Technology (RIT), where the system is installed and operational as part of the Ultra-High-Density Interconnect (UHDI) Consortium research program.
The demonstration opportunity provides industry professionals with firsthand access to advanced stencil inspection technology in a university research environment. The T100 serves as the consortium’s core stencil metrology platform, supporting independent evaluation of stencil technologies for increasingly demanding electronics assembly applications.
As the electronics manufacturing industry moves toward smaller components, finer-pitch interconnections and more complex PCB designs, solder paste printing accuracy remains a critical factor in achieving consistent assembly quality. Stencil aperture dimensions, positional accuracy and mesh tension can influence solder paste deposition, making reliable inspection essential to process control.
The Sa...